Let's Get Technical!
Watch this video to see a technical walkthrough of die serialization from semiconductor wafers within RunCard.
The semiconductor wafer to die serialization process, a critical step in module manufacturing, requires precise tracking and documentation to maintain high quality and reliability of complex semiconductor products.
Traceability, the ability to trace a product or component back through its history, is essential in this context. By capturing and recording each step of individual die (chip) handling from attachment through final testing, manufacturers ensure that each assembled device meets high-quality standards and may be traced back through its full genealogy in case issues arise that need precise determination to correct process deficiencies or quickly prove to an end customer that no issues exist.
In this blog, we will explore how Intraratio's RunCard, a full-featured Manufacturing Execution System, enables comprehensive tracking of die serialization.
In semiconductor manufacturing, wafer ID tracking and die serialization are essential to ensuring precision, traceability, and quality control throughout the production process. Wafer ID tracking monitors individual wafers from start to finish, while die serialization provides unique identification for each device on a wafer. This comprehensive system optimizes yield, facilitates failure analysis, and enables robust process control.
RunCard provides complete end-to-end traceability and genealogy tracking for die and wafers, from the wafer fab through packaging and test. This comprehensive visibility ensures that every stage of production is meticulously documented, allowing for seamless tracking and quality control.
Improved Yield Management: By tracking the wafer ID and die serialization, RunCard provides actionable insights into performance at the wafer and die level, helping identify areas for process optimization and yield improvement.
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