"Let's Get Technical" Short Video Series: Traceability in Die Attach leveraging DataCard

Let's Get Technical!

Watch this video to see a technical walkthrough of DataCard's approach to end-to-end traceability in die attach.   

The semiconductor die attach process, a critical step in module manufacturing, requires precise tracking and documentation to maintain critical quality and reliability.

Traceability, the ability to trace a product or component back through its history, is essential in this context. By capturing and recording each step of die handling, from attachment through final testing, manufacturers ensure that each assembled device meets high-quality standards and may be traced back through its full genealogy in case of issues.

In this blog, we will explore how Intraratio's DataCard's advanced traceability solution enables comprehensive tracking and analysis of the die attach process.

How does DataCard handle high-performance traceability data and machine integration?

DataCard's advanced system can pull various data sources, including real-time data from test, assembly, and quality processes, and seamlessly integrate with external sources like semiconductor and MEMs wafer fabrication and outsourced test and assembly. Its efficient and scalable architecture allows for easy integration from single factory lines to global deployments.

Any machine data source can be mapped into DataCard, and massive amounts of data can be automatically ingested simply by dropping it into a designated network location.

Additionally, DataCard integrates with RunCard to automate quality checks (such as SPC and bin limits) and material transactions. DataCard also supports a proprietary XML format for structured data insertion, ensuring compatibility with custom data formats.

How does DataCard ensure comprehensive traceability in the die attach process?

DataCard captures critical real-time information like process parameters (temperature, pressure, alignment, etc.), equipment data (machine settings, maintenance, calibration), material lot information (die, adhesive, solder), operator data, and post-process inspection results (bond strength, void detection, alignment), ensuring comprehensive oversight and quality control.

DataCard also tracks die-level traceability, including X-Y coordinates, genealogy data, and wafer maps, to ensure full visibility and quality control throughout the entire process.

Furthermore, DataCard can store a wafer map that offers a comprehensive view of test results, helping to identify patterns and trends across the wafer, which is critical for analyzing defects and improving process outcomes.

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